Epoxy mould release agent, high temperature
W770 is a versatile, fast evaporating release agent that offers excellent release for various moulding applications. It is odorless, offers high gloss and slip and doesn' t form mold build up. It cures at room temperature and can be applied to mold surfaces at room temperature up to 60 oC.
DIRECTIONS
Apply by spraying, brushing or wiping with a clean lint-free cloth. When spraying, ensure a dry air source is used or use an airless spray system. If possible, before applying W770, warm the mold to approximately 50 oC in order to drive off any moisture entrapped on the mold surface.
Intrastat Number for this product: 27121090
Product MDS